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Engineering & Manufacturing

All Kavlico sensors are designed, manufactured, and tested at our highly automated facilities located in Moorpark, California, Tijuana, Mexico and Minden, Germany. From product design and development to manufacturing and final test, you can depend on Kavlico sensors to be rugged, accurate, reliable, and cost-effective.

Product Development

Employee working
  • Pressure sensor design and prototype fabrication
  • Mechanical design and prototype fabrication
  • Hybrid, PCB and ASIC electronic circuit design and layout
  • Ceramic capacitive, silicon piezo-resitive or capacitive MEMS, and stainless steel thin film TiON technologies
  • Stress analysis
  • CAD
  • Tooling, fixtures, and equipment design and fabrication

Manufacturing

Assembly Line
  • Flexible manufacturing
  • Automated vision systems
  • Digital programming
  • Thick film laser trimming
  • Heavy aluminum wire bonding
  • Ultrasonic welding
  • Temperature testing from -40°C to +150°C
  • 100% pressure testing
  • Value added assembly
  • Internal automation development
  • Assembly line development
  • Fully automated
  • Semi-automated
  • Automation engineering & design team
  • Integrated into product development
  • Mechanical & electrical assembly
  • PC & PLC programming
  • Lifetime support of tooling
  • Surface mount component placement
  • Thick film screening & firing
  • Automated manufactoring
  • Silicone fluid filling in vacuum
  • Vacuum sealing
  • Welding (laser, TIG, resistance, friction, and ultrasonic)
  • Brazing, soldering, epoxy, and UV cure
  • Soldering (automated, hand dip, screening, and reflow)
  • Silicon micro-machining
  • Wire bonding
  • Coil winding
  • Machining (milling, lathe, grinding, cutting, etching, and lapping)

Facilities & Tooling

Employee working
  • Class 10 & 100 Clean Room Silicon Wafer Fabrication
  • Silicon wafer processing
  • Silicon wafer processing
  • Wafer bonding
  • Photolithography
  • Oxidation
  • Wet/Dry Etch
  • Thermal Processing
  • Wafer inspection
  • CMOS
  • Class 10000 Clean Room
  • Wafer sawing & cleaning
  • 100% die probe and inspection
  • Automated manufactoring
  • Pressure die matching
  • Automated die attach
  • Automated thermosonic gold wire bonding
  • Gel dispense & cure under vacuum
  • Scanning electron beam microscope (SEM)
  • Failure analysis laboratory
  • Reliability laboratory
  • Metrology laboratory